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Electron Backscatter Diffraction Ebsd Mapping, supplied by JEOL, used in various techniques. Bioz Stars score: 97/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
Electron Backscatter Diffraction (Ebsd) Maps, supplied by Thermo Fisher, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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electron backscatter diffraction ebsd map  (JEOL)
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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electron backscatter diffraction ebsd mapping  (Thermo Fisher)
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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electron backscatter diffraction ebsd maps  (Oxford Instruments)
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of <t>EBSD</t> and nanoindentation mapping in the current study is indicated in (b).
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Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of EBSD and nanoindentation mapping in the current study is indicated in (b).

Journal: Materials Science and Engineering: A

Article Title: Submicrometer Scale Mapping of Microstructure and Mechanical Properties of Cold Sprayed Copper

doi: 10.1016/j.msea.2024.147556

Figure Lengend Snippet: Fig. 1. (a) Illustration of typical microstructure of as-deposited cold sprayed Cu after [14]. Small grains due to dynamic recrystallization (DRX) are located near the splat-splat interfaces, while towards the interior of the splats subgrains and deformed large grains are present. The local region of EBSD and nanoindentation mapping in the current study is indicated in (b).

Article Snippet: Electron backscatter diffraction (EBSD) mapping was performed using a Bruker QUANTAX EBSD system at 15 kV.

Techniques: Recrystallization

Fig. 3. SEM/EBSD/nanoindentation results of the as-deposited CS-Cu N2 sample: (a) BSE image, (b) SE image, (c) IPF map, (d) GBCD map with the Brandon criterion, (e) KAM map, (f) GND map overlaying with the grain boundaries (misorientation angle >5◦) in black lines, (g) BSE image after nanoindentation, (h) hardness map.

Journal: Materials Science and Engineering: A

Article Title: Submicrometer Scale Mapping of Microstructure and Mechanical Properties of Cold Sprayed Copper

doi: 10.1016/j.msea.2024.147556

Figure Lengend Snippet: Fig. 3. SEM/EBSD/nanoindentation results of the as-deposited CS-Cu N2 sample: (a) BSE image, (b) SE image, (c) IPF map, (d) GBCD map with the Brandon criterion, (e) KAM map, (f) GND map overlaying with the grain boundaries (misorientation angle >5◦) in black lines, (g) BSE image after nanoindentation, (h) hardness map.

Article Snippet: Electron backscatter diffraction (EBSD) mapping was performed using a Bruker QUANTAX EBSD system at 15 kV.

Techniques:

Fig. 4. SEM/EBSD/nanoindentation results of the 350 ◦C annealed CS-Cu N2 sample: (a) BSE image, (b) SE image, (c) IPF map, (d) GBCD map with the Brandon criterion, (e) KAM map, (f) GND map overlaying with the grain boundaries (misorientation angle >5◦) in black lines, (g) BSE image after nanoindentation, (h) hardness map.

Journal: Materials Science and Engineering: A

Article Title: Submicrometer Scale Mapping of Microstructure and Mechanical Properties of Cold Sprayed Copper

doi: 10.1016/j.msea.2024.147556

Figure Lengend Snippet: Fig. 4. SEM/EBSD/nanoindentation results of the 350 ◦C annealed CS-Cu N2 sample: (a) BSE image, (b) SE image, (c) IPF map, (d) GBCD map with the Brandon criterion, (e) KAM map, (f) GND map overlaying with the grain boundaries (misorientation angle >5◦) in black lines, (g) BSE image after nanoindentation, (h) hardness map.

Article Snippet: Electron backscatter diffraction (EBSD) mapping was performed using a Bruker QUANTAX EBSD system at 15 kV.

Techniques: